The influence of the corrosive medium and passivator concentrations on the
corrosion and passivation of copper was studied
by electrochemical messurement technologies. The
components of the passive films were analysed with XPS. The behavour of abration, which was performed with polishing pressure and rotationl velocity, and repassivation on the surface of copper was invesitigated. The polarization curves of copper during chemical mechanical polishing were messured. The results indicated that, copper was passivated very easily in the methylamine aqueous medium with K_3Fe(CN)_6, the main components of the passive films were Cu_4
and a little Cu_2O. The abration characteristics of films varied with the components concentrations. Whether difficult or easy the passive films were abraded depended on the properties of the films, the polishing pressures and rotational velocities. Because of the films being abraded during polishing, the corrosion rate was quickened and the corrosion current density was increased greatly. The slurry of 0.1% methylamine aqueous solution+0.5%K_3Fe(CN)_6+5%Al_2O_3 was feasible.