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Shvoong Home>Business & Economy>SEM analysis of particles and its effects in arc ion plating Summary

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SEM analysis of particles and its effects in arc ion plating

Article Summary by: TsingHua    

Original Author: Journal of Chinese Electron Microscopy Society
The effects of line magnetic filtering on the particles density and size in TiN and TiAlN films deposited by using arc ion
plating have been examined by SEM. It showed that the maximum diameter and density of particles in TiN film were decreased from 14μm to 3μm and from 10~9/cm~2 to 10~5/cm~2, respectively. The size of maximum particle of TiAlN film in arc ion plating was to up 20μm because metal Al with low melting point was vaporized from TiAl targets. Using line magnetic filtering and with direct adding pulse bias, the size of particles in TiAlN film was decreased remarkably. The particles density of TiAlN film were decreased to 10~6/cm~2. The particles of TiN/CrN multilayer films in arc ion plating reduced the adhesion between film and substrate, and performed the transmissibility of pinholes. The density and maximum size of particles in the films were decreased observably when line magnetic filtering and with pulse and DC bias were applied at same time. Small particles were embedded in multilayer TiN/CrN films.
Published: June 25, 2004
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