• Sign up
  • ‎What is Shvoong?‎
  • Sign In
    Sign In
    Remember my username Forgot your password?

Summaries and Short Reviews

.

Shvoong Home>Science>Mechanism of Material Removal and Surface Generation by Molecular Dynamics Analysis in Abrasive Proc Summary

.

Mechanism of Material Removal and Surface Generation by Molecular Dynamics Analysis in Abrasive Proc

Article Abstract by: TsingHua    

Original Author: Nanoteohnology and Precision Engineering
At present, the machining theory based on the elasticity and fracture mechanics can not explain micro-machining mechanism
completely. Molecular dynamics analysis has the particular advantage in researching the solid deformation of atom-scale area. It can aid in surveying the force features of grinding and indentation, stress state and grinding temperature and then explaining the micro-scale mechanism of the material remove and surface generation. The research shows: The atoms of the reconstituting crystal lattice and non-crystal lattice are piled up on the front of abrasive grain, with the continuous advancement of the abrasive grain, the material are removed; The hydrostatic stress has a great impact on the degree of the reconstituting crystal lattice and the formation of the non-crystal atoms; The degenerative layer of the finish surface are reconstituted by the severe deformation crystal lattice and the non-crystal atoms in the grinding surface, it consists of the outer non-crystal layer and the inner lattice deformation layer.
Published: June 30, 2004
Please Rate this Review : 1 2 3 4 5

Bookmark & share this post

.