Effect of impurity ions on microstructure of copper deposition

The study on the effect of impurity ions As5+, Sb3+, Bi3+, Fe2+, Fe3+, Ni2+, Zn2+ in electrolyte on the microstructure of copper deposition by simulating the production process and XPS, XED, SEM to reveal the behaviour of impurity ions in the course of the copper electrocrystal and improve quality of electrolysis copper indicates that the impurity ions do not deposit on cathode when i≤220 A/m2, but they can inhibit the other crystal orientation growth and increase T.C of crystal orientation (220) of copper crystal. The impurity ions can enlarge the cell size of copper crystal and change the electrocrystals from ridgelike to ridgeblocklike. When  i>220 A/m2, a small amount of As5+and Bi3+ begins to deposit on cathode, and they exist in the form of As, As2O3 and Bi2O3 in the deposited copper, and roughen the grain of copper crystal. The preferred crystal orientation of copper change from (220) to (111) when the current density increased to 800 A/m2.