Double glow discharge was applied to pure copper substrate to obtain Tipermeated layer. The depth distribution of the microhardness of the Tipermeated layer was measured on a microhardness tester, its phase composition was examined by means of Xray diffraction, and its morphology and crosssection were observed with a scanning electron microscope. The friction and wear behavior of the Tipermeated layer sliding against SAE52100 steel counterpart was comparatively evaluated with that of the Cu substrate on an MM200 friction and wear tester. The worn surface morphologies of both the Cu substrate and the Tipermeated Cu specimens were observed and on a scanning electron microscope as well. The results showed that the Tipermeated layer on the Cu substrate had much higher microhardness and much better wearresistance than the pure Cu. This was attributed to the eutectic strengthening effect of the αTi and the dispersive strengthening effect of the Cu4Ti precipitation formed in the Tipermeated layer during the Tipermeation process by double glow discharge. The worn surface of the Cu substrate was characterized by severe adhesion and peeling off, while that of the Tipermeated Cu by mild scuffing, which were related to their different friction and wear behaviors.