Study on Mechanical Energy Aided Siliconizing

ST5”BZ>The mechanical energy aided siliconizing process is developed.The process temperature is decreased from 950～1050℃ of traditional process to 480～540℃.60μm thickness siliconizing layer is obtained by heating 4h at 540℃ using the agent made by ourselves.The hardness of the siliconizing layer is 700HV 0.1 ,and from outer to inner,the hardness of the layer decrease to the hardness of the matrix gradually.The phase in the surface of the siliconizing layer is Fe 3Si.Obvious holes are not found in the compact siliconizing layer,so free-hole siliconizing can be available.The silicon content in the siliconizing layer is about 18%wt,above that of traditional process.The mechanical energy aided siliconizing process has lower heating temperature,shorter heating time,greater energy-saving effect,higher products quality,less equipment investment,vaster raw materials source and cheaper cost,so this process seems to have a wide application in the corrosion-resistant realm.