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Shvoong Home>Science>The Present Situation, Applications and Expectation of Electroless Plating Summary

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The Present Situation, Applications and Expectation of Electroless Plating

Article Abstract by: TsingHua    

Original Author: HOT WORKING TECHNOLOGY
This abstract was translated from 化学镀的研究现状、应用及展望
As a fine surface technology, electroless plating is applied to almost every industry branch. In this paper, the present
situation of electroless plating, and the applications of several main electroless plating techniques such as Ni P, Pd are reviewed. The new technique of electroless copper plating is specially narrated, and the uptrend of the research of elctroless plating is also indicated. Key words: Electroless Plating; Present Situation;Applications;Uptrend of Researchcluding particle leaking from louver plate and particle stopping on louver plate were analyzed;and the design criteria for louver plate were established,which agree well with the experimental results.Three factors of louver plate such as its length( d 3),distance ( d 4) and angle from the horizon (θ) could be determined as followed:θ≥π2-φ i 2+φ w 2- cos -1 sin φ w sin φ i 2, d 4d 3<( tg φ i + tg θ) cos θ
Published: April 20, 2000
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