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Shvoong Home>Science>A simulation study for the effects of cooling rate on evolution of microstructures during solidifica Summary

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A simulation study for the effects of cooling rate on evolution of microstructures during solidifica

Article Abstract by: TsingHua    

Original Author: Acta Physica Sinica
A simulation tracing study has been performed for the effects of different cooling rates on the evolution of microstructures
during solidification process of liquid metal Ga by means of molecular dynamics method. The bond_types and basic cluster structures of metal Ga have been analyzed by using HA bond_type index method and cluster_type index method. It has been found that the cooling rate plays an important role to the microstructures in the solidification processes. At the cooling rates of 1.0×10~ 14 K/s, 1.0×10~ 13 K/s and 1.0×10~ 12 K/s, the amorphous structures would be formed in the system with the rhombohedron related to 1311, 1301 bond_types as the main body, and coexist with the fcc, hcp and other structures; at the cooling rate of 1.0×10~ 11 K/s, crystallization would take place in the system, the crystalline transition temperature T_c being about 198K, and the lower the cooling rate, the higher the T_c. The crystal would have the orthorhombic structure related to 1421 bond_type(determined by visualized method) as the main body. This gives us a new way for researching the crystalline transition processes of liquid metals.
Published: January 01, 2006
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