The conductive is a main component of conductive composite for electronics. In order to prevent the migration of Ag in Ag-base
filler and to overcome the shortage of Ag plated Cu powders in use, a new method of preparing
Cu-Ag alloy powders for conductive fillers were investigated. In the present paper, the mixed Cu-Ag alloy powders of the flake Cu-Ag alloy powders(Ag-rich solid solution, SAg(Cu) of 15μm in average diameter) and the spherical Cu-Ag alloy powders(Cu-rich solid solution, S Cu (Ag)of 2μm in diameter) were directly prepared by chemical reduction of Cu2+ and Ag+ using ascorbic acid as the reducing agent. The influences of factors, such as the amount of AgNO3, the concentration of CuSO4, the reaction temperature on the
oxidation resistance and conductivity of Cu-Ag alloy powders were studied. It was found that the above factors obviously affected the properties of Cu-Ag alloy powders, the Cu-Ag alloy powders prepared under the conductions of 60 ℃,0.2mol/L CuSO4, 0.2mol/L AgNO3, the volume ration of CuSO4 to AgNO3=10:10 remained free from oxidation and unchanged conductivity in<700℃ calcinations.