W/Cu functionally gradient material (FGM) has excellent mechanical properties since it can effectively relax interlayer
thermal stresses caused by the mismatch between their thermal expansion coefficients. W/Cu FGM combines the advantages of
tungsten such as high melting point and service strength, with heat conductivity and plasticity of
copper at room temperature. Thus it demonstrates satisfactory heat corrosion and thermal
shock resistance and will be a promising candidate as divertor component in thermonuclear de-vice. Owing to the dramatic difference of melting point between tungsten and copper, conventional processes meet great difficulties in fabricating this kind of FGMs. A new approach termed
graded sintering under ultra-high pressure (GSUHP) is proposed, with which a near 96% relative density of WICu FGM that contains a full
distribution spectrum (0-100%W) has been successfully fabricated. Suitable amount of transition metals (such as nickel, zirconium, vanadium) is employed as additives to activate tungsten's sintering, enhance phase wettability and bonding strength between W and Cu. Densification effects of different layer of FGM were investigated. Microstructure morphology and interface elements distribution were observed and analyzed. The thermal shock performance of W/Cu FGM was also preliminarily tested.