The pulsed electric current produced by discharging of capacitors passed through the double solenoids with ferrosilicon core,
and the instant strong
pulsed magnetic field with the oscillating and declining characters was made between two ferrosilicon cores. The effect of high-pulsed magnetic field on the unidirectionally solidified Al-Cu eutectic microstructure with 10 μm/s drawn velocity was investigated. The AI-Cu eutectic solidified morphology experiences three evolution stages which are regular columnar structure to breaking off fine grain, coarsening dendrite to newly regularization columnar structure with increasing of charge energy. Rich copper phase evidently comes out of inter eutectic cells and the eutectic spacing decreases in newly regularization specimen. The stability of solidified interface is analyzed by coupling of
induced electric potential field and solute diffusion field. The result showed that induced electric potential field caused by high pulsed magnetic field in metallic melt brought into oscillating solute electro-migration in front of solidifying interface, which has the effects of promoting solute diffusion inter-dendrite and reducing the constitutionally supercooling region.